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Electronics October e-Newsletter


Detect Faults and Anomalies of Electronic Components and Assemblies Using Lock-in Thermography

Today many manufacturers of electronic components and assemblies use thermographic cameras during product development. InfraTec is opening up a completely new range of opportunities to such users. A package for Lock-in Thermography gets you off to a successful start in such challenging measurement tasks at an exceptional attractive price. This includes the VarioCAM® HDx...

Latest Headlines
ROLEC profiPLUS suspension arms now in two models
Supporting Critical Embedded Computing - ASIC Product Replication
OMC adds new dust-proof FDH1M SMA bulkhead receptacle to range of advanced fibre optic connector systems
New 30° beam angle SMD LEDs from OMC emit light further for high-intensity applications
Products & Services
IBASE Release ATX Motherboard Based On Latest 8th Generation Intel Core Processor Family   Nonstop Power: Maintenance-free Supercap energy storage for modular DC UPS system   Thermal imaging and furnace surveys in the steel and metals industry
New Cadence Tensilica DNA 100 Processor IP Delivers Industry-Leading Performance and Power Efficiency for On-Device AI Applications   The future is on the horizon – will you be there?   Get connected with the Interconnection Specialists
New Potting Compound with Excellent Flow Properties   METCASE Launches New 19” Rack Enclosures   New Spot Size Calculator App
Smart Sensor for Condition Monitoring   First congatec SMARC 2.0 module with NXP i.MX8 processor   New GORE® PolyVent XS Makes Room for More Design Options in Smaller, Lighter-Weight Housings
Series 9 offers wide range of APDs optimized for LIDAR applications   IP68 Die Cast from Evatron   Profiling aluminum vacuum brazing furnaces
HE-Y7 relay: The solution for every high-power application   38VIN, 10A Boost µModule Regulator Ideal for Driving LEDs   Push-pull connectors ‘Made in Germany’ for future-proof industrial applications
Stay up-to-date with Electronics

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