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CIE

19/7/2018

 
Latest Headlines
         
  TE Connectivity’s AmbiMate sensor module MS4 series, now at Mouser, offers easy environment sensor integration   What’s New in Electronics (WNIE) announces UK debut of the IPC-CFX Showcase   Nikon Metrology delivers 1,000th 160 kV X-ray source for electronics inspection systems   Cadence Automotive Solution for safety verification used by ROHM to achieve ISO 26262 ASIL D certification  
 
 
 
Weekly Highlights
Custom-Width Sloping Front Enclosures From METCASE   Microchip releases first 32-bit MCUs to feature robust, chip-level security and Arm TrustZone® technology
METCASE can supply its modern and robust UNIDESK aluminium sloping front enclosures in custom widths to suit customer requirements.Robust and attractive UNIDESK is suitable for...   Microchip announces the new SAM L10 and SAM L11 families of 32-bit microcontrollers (MCUs) which address the growing need for security in Internet of Things (IoT) endpoints by...
 
New options for ROLEC’s aluCASE diecast enclosures   SMD solid-state fuse for the most demanding applications
ROLEC has added new options to its aluCASE range of diecast aluminium enclosures: transparent lids, integrated hinges and a console adapter for desktop use.Smart modern aluCASE...   SMD solid-state fuse for the most demanding applicationsSCHURTER’s new High Current Fuse, HCF, is an extremely robust SMD fuse, designed using solid-state / thin-film...
 
 
Components in Electronics
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